High volume adhesive dispensing is made easy with Global Stencil’s new Accu-Dot^TM  adhesive stencil technology.  As component counts continue to increase and placement equipment speeds continue to increase, the assembly bottleneck has become the adhesive deposition process.  Adhesive printing at speeds far exceeding the fastest dispensers currently on the market is easily achieved using screen printing platforms and our Accu-Dot^TM Stencils.   Unlike the competition, these stencils are fabricated from solid aluminum.  The adhesive reservoirs and clearance for protruding parts are precision CNC machined and the adhesive apertures are created with the same high precision lasers that produce SMT solder paste stencils.  To create the ultimate printing stencil, a  nickel finish is applied to the surface creating a hard, durable product capable of resisting constant wear by metal squeegees. This aluminum based stencil also outperforms the competition by holding up to the harsh solvent based cleaning environments used in the adhesive process.

Using custom designed adhesive patterns, Global Stencil provides a  stencil technology capable of producing multiple height adhesive dots from a single thickness stencil.  With the laser cutting process, we are not limited to round designs and can use a variety of shapes to optimize the adhesive process.  A reservoir is created on the top side of the stencil and the apertures are laser cut through the remaining material creating an unlimited number of individual nozzles.

In many cases thick stencils can be blade printed, but new pump printing technology is recommended  to generate pressures needed to force adhesive into small diameter apertures.  Since the print process is completed in a single stroke, cycle time is constant and is not dependant on the number of adhesive dots. 

This technology can be used for many other applications, for example,  adhesive over paste.  If you have any questions please contact our Customer Service Department for assistance. 

Benefits of Accu-Dot^TM  Stencils:

• Adhesive can be deposited for bottom side SMT component placement after top side through hole parts are placed
• Adhesive can be deposited between SMT pads after solder paste is printed and before reflow
• Variable dot heights are available with one stencil
• Any geometric shape can be printed for optimum adhesion of large mass devices
• Adhesive deposition cycle time is constant, and is not dependant on the number of dots
• Stencil cleaning is much easier than plastic or laminated stencils
   

(LEFT) Close up of top side of stencil Illustrating round adhesive reservoir and laser cut slotted apertures.
(CENTER) Close up of bottom side of stencil illustrating through apertures for adhesive deposition and machined areas to clear leads protruding through stencil.

- CLICK HERE FOR CONTINUED INFORMATION -