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With
"leaded" paste, you can often adjust the volume of
your paste (preventing tomb-stoning, bridging,
and solder deficiencies) by adjusting the aperture
size or shape rather than using a 'step down'
stencil, or 'variable height' stencil?
Click here for more.
However, with 'lead-free'
paste, there is typically a solder volume loss of
about 15% compared to solder pastes containing lead.
Because of this loss, aperture sizes are typically
left 1:1 with the surface pad and greater volume is
achieved, if needed, by using a 'step down' or
'variable height' stencil.
More coming soon. |
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FREE Gerber Viewer
GC-Prevue download at
www.graphicode.com |
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Debunking
the Myth
Contrary to
the sales rhetoric touting electroformed
stencils as the only viable choice for volume
control in lead-free printing, tests have shown that
a step-down, laser-cut stencil of Invar or Alloy
performs just as well - and costs much less!
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Are you puzzled
by all of the acronyms
used in the PCBA Industry? |
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Tools of the Trade
